Master Builders, Designers and Investors

Timber Structures 3.0 AG

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Timber Structures 3.0 AG
Niesenstrasse 1, 3600 Thun
Tel: (+41) 058 255 15 80
info@ts3.biz


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Symposium "New perspectives in wood bonding"

27.09.2018

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The Architecture, Wood and Civil Engineering department at Bern University of Applied Sciences in Biel is holding a symposium at the end of October. Experts from commerce and research will present innovative applications as well as the latest developments in wood bonding. This year, the event will pick up on the topic of adhesives for wood material production. TS3 will present a new technology.

The second symposium on "New perspectives in wood bonding" will take place on 31 October 2018 in Biel. This will be the first year in which the event will pick up on the topic of adhesives for wood material production. Bern University of Applied Sciences (BFH) was able to attract Dr Manfred Dunky, a profound expert on organic adhesives, as a speaker. The symposium will also address new and innovative bonding methods such as the Timber Structures 3.0 technology from TS3. The symposium is Switzerland's most important platform for everyone with an interest in wood bonding who wants to engage in an exchange about the latest innovations and trends.